IPC 7095 BGA Rework Certification
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This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the line BGA Rework Systems. Topics include a review of thermal profiling, preheat considerations, process techniques, review and interpretation of x-ray results. There are two methods you might use to identify and build a BGA rework profile. Which one you will use will depend on whether or not you have a test profile printed circuit board or sample PCB available. Your options are:
In both cases, it is important to monitor not only overall PCB temperature but also BGA part center and edge joint temperatures. This is a 2 or 3-day optional course. One day lecture and up to 2 - days of hands-on training. Each student will be able to practice installing, removing, and re-balling BGA components using both Lead & Lead-Free Solders. $800.00 per person. |
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See: https://www.pcb-repair.com/training/ipc-7095-bga-rework/ |
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