Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are:
Placement force: regular placement vs "force applied" to dip the component on the solder paste. Reflow profile (watta surprise...): low temp vs high temp (206 peak vs 228)
We're going to conduct a DOE to optimize process and the experiment will be a 2 factor 2 level. Here we have some "DOE" gurus but they're not so much involved in SMT, the question is: anybody has a excel spreadsheet or the metodology to conduct this "simple" DOE?? I will like to evaluate on parallel to our DOE masters to see how different or simmilar the calculation is.
I have search on DOE and design of experiments but I think is too complex for what I'm looking for and some people are too elevated for my experience, on other thread i read that "you will need such a training to be able to determine a DOE" but I think is not so complex once you have a template and just drop the data this is why I'm requesting it here with the SMT experts ;)
best regards.
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