Packaging Engineer

SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critical role in our business. In this role, you'll provide support to customers with Wafer Level and Ball Grid Array packages. Specific responsibilities include: - Support marketing with Surface Mount Application Guidelines, technical support during customer visits, and technical promotional material (application guidelines, design guidelines). - Provide packaging and Surface Mount Technology (SMT) application support for all package-related issues at customer sites worldwide. - Develop new package technologies in support of HVAL business organizations. - Support SMT guideline generation for HVAL pin / packages (BGA, QFN, WCSP, PowerPad and Leadframe base packages). - Generate PCB layout, land patterns, stencil design drawings, solder paste, and reflow profile selections. - Provide customer support with all board assembly related issues (PCB design, equipment capability, pick up tools, rework process, hand testing). - Generate design guides and application notes for various packages. - Train and educate customers as well as the TI sales force on issues related to advanced packages. - Address all quality, information, data, and training requests coming from customers and field sales. This engineer must be up-to-date on industry standards and be willing and able to travel domestically and overseas. 5+ years of related experience is needed. Additional language skills (Chinese, Japanese, and Korean) are a plus. Prior experience writing application notes and design guides is also needed.