Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs
Published: |
October 16, 2014 |
Author: |
Rama Hegde, senior member of technical staff; Freescale Semiconductor. |
Abstract: |
Key points are: *Long-term storage of BGA & QFP products may be required due to:
* Integrity of EOL products in terms of solderability needs to be verified.... |
You must be a registered user to talk back to us. |
Company Information:
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs article has been viewed 758 times