Full Site - : 0.13 (Page 7 of 31)

Hot melting tape for electronic components /Aluminum Electrolytic capacitors,LED etc.

Hot melting tape for electronic components /Aluminum Electrolytic capacitors,LED etc.

New Equipment | Components

Materials: Backing: flat back paper Adhesive: rubber Thickness: 0.13mm Adhesion: 7N/in Ball tack (No.#14): 10 Holding power: 72hrs Tensile strength: 150N/in Elongation: 1% Applications: widely used in masking of diode belting Features: Ada

Shenzhen Shunyuan Tapes Co.,Ltd.

Flat Cable :HG20001-6P TO HG20001-6P L=300MM

Flat Cable :HG20001-6P TO HG20001-6P L=300MM

New Equipment | Components

Type Flat Cable :HG20001-6P TO HG20001-6P L=300MM Operating voltage 300V Current Rating 4A Temperature Range operating -15ºC~+80ºC Cable specification Conductor Tin Plated

Beijing Yuanda Innovation Technology Co., Ltd

Flat Cable :HG20001-6P TO HG20001-6P L=300MM

Flat Cable :HG20001-6P TO HG20001-6P L=300MM

New Equipment | Components

Type Flat Cable :HG20001-6P TO HG20001-6P L=300MM Operating voltage 300V Current Rating 4A Temperature Range operating -15ºC~+80ºC Cable specification Conductor Tin Plated

Beijing Yuanda Innovation Technology Co., Ltd

DEK Unveils Large Print Area Europa Platform at APEX

Industry News | 2008-03-26 00:42:45.0

World leading screen printing and mass imaging specialist DEK is to unveil a large area version of its Europa print platform at APEX. Called the Europa Vi, the new machine offers substrate printing to 24" x 24" (610mm x 610mm) on demand to meet the diverse volume, mix and size requirements of modern production environments.

ASM Assembly Systems (DEK)

SAMSUNG Licenses ARM Microprocessor Cores - Agreement Enables Samsung To Target 800 MHz Standard Products

Industry News | 2001-07-16 08:57:06.0

ARM and Samsung today announced that Samsung has licensed the ARM926EJ-S(TM), the ARM946E(TM) and the ARM1020E(TM) microprocessor cores for use in its system-on-chip (SoC) devices.

Samsung Electronics

SEZ, IMEC to Explore Next-generation Wafer Cleaning Technologies

Industry News | 2002-04-11 08:38:03.0

A Joint-development Initiative for Environmentally Friendly, "Economically Viable" Wafer Cleaning Technology

IMEC

Conductive Non-woven Fabric

Conductive Non-woven Fabric

New Equipment | Coating Materials

Our conductive non-woven fabric is plated Cu+Ni on non-woven fabric,it has good conductivity and shielding effectiveness,it is widely used in various electronic products.The thickness of our non-woven fabric is 0.035mm,0.045mm,0.04mm,0.08mm,0.10mm,0.

China EMI Shielding Materials Co.,LTD

Conductive Non-woven Fabric

Conductive Non-woven Fabric

New Equipment | Coating Materials

Our conductive non-woven fabric is plated Cu+Ni on non-woven fabric,it has good conductivity and shielding effectiveness,it is widely used in various electronic products.The thickness of our non-woven fabric is 0.035mm,0.045mm,0.04mm,0.08mm,0.10mm,0.

China EMI Shielding Materials Co.,LTD

USB 2.0 Cable: USB A TYPE MALE TO MINI USB MALE 5PIN

USB 2.0 Cable: USB A TYPE MALE TO MINI USB MALE 5PIN

New Equipment | Components

Type Type USB 2.0 Cable: USB A TYPE MALE TO MINI USB MALE 5PIN Electrical Operating voltage 30V Current Rating 1A Temperature Range operating -15ºC~+80ºC Impedance 90±10ω

Beijing Yuanda Innovation Technology Co., Ltd

Universal 43470604 / 43470603 SMT AI parts

Universal 43470604 / 43470603 SMT AI parts

New Equipment | Components

Universal SMT AI parts 43470604/43470603 universal AI parts UNIVERSAL-44241405 universal AI parts UNIVERSAL-44241405 UNIVERSAL-43366213 UNIVERSAL-43366113 UNIVERSAL-43077104 , UNIVERSAL-43077004 UNIVERSAL-26462010 UNIVERSAL-Kit basic hand tool-4574

ZK Electronic Technology Co.,Limited


0.13 searches for Companies, Equipment, Machines, Suppliers & Information