Full Site - : 0.2mm pitch bga (Page 7 of 140)

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

SMTAI 2009 Call For Papers Reminder

Industry News | 2009-01-23 19:18:23.0

You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.

Surface Mount Technology Association (SMTA)

IPC APEX India Technical Conference to Highlight Pathways for Growth in the India Electronics Manufacturing Future

Industry News | 2013-07-17 19:05:42.0

IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.

Association Connecting Electronics Industries (IPC)

IPC APEX India Technical Conference to Highlight Pathways for Growth in the India Electronics Manufacturing Future

Industry News | 2013-07-19 11:33:18.0

IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.

Association Connecting Electronics Industries (IPC)

Juki JUKI 102 nozzle E35027210A0

Juki JUKI 102 nozzle E35027210A0

Parts & Supplies | Chipshooters / Chip Mounters

JUKI 102 nozzle E35027210A0 JUKI E5112715000 BU SPACER (0.8) JUKI E5113715000 BU SPACER (1.0) JUKI E5114715000 BU SPACER (1.2) JUKI E5115706000 LEVER 24 JUKI E51157060A0 LEVER 24 ASM. JUKI E51157060B0 LINK ASM JUKI E5115706AB0 RINK 24 ASM JUKI E511

ZK Electronic Technology Co., Limited

Juki JUKI FEEDER part E513070600B

Juki JUKI FEEDER part E513070600B

Parts & Supplies | Pick and Place/Feeders

JUKI FEEDER part E513070600B E9630729000 T AC SERVO MOTOR(TS4632N2020E600) E9630755000 RERAY UNIT E96307800A0 HEAD SENSOR ASM E963171500A DUCT (KD-76-03-C) E963171500B DUCT (KD-76-045-C) E963171500C DUCT (KD-76-085-C) E9631721000 LAHD SENSOR

ZK Electronic Technology Co., Limited

Juki JUKI FF 44MM feeder tape guide E72037060AC

Juki JUKI FF 44MM feeder tape guide E72037060AC

Parts & Supplies | Pick and Place/Feeders

JUKI FF 44MM feeder tape guide E72037060AC E9630729000 T AC SERVO MOTOR(TS4632N2020E600) E9630755000 RERAY UNIT E96307800A0 HEAD SENSOR ASM E963171500A DUCT (KD-76-03-C) E963171500B DUCT (KD-76-045-C) E963171500C DUCT (KD-76-085-C) E96317210

ZK Electronic Technology Co., Limited

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Technical Library | 2007-02-01 09:57:15.0

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.

BEST Inc.

BGA X-Ray Inspection

BGA X-Ray Inspection

Videos

BEST's BGA x-ray inspection capabilities are shown as one of the x-ray techs "drives around" the BGA after BGA rework. During BGA x-ray inspection the first view is a macro one followed by zooming in and examing each area closely. Look at our BGA X-

BEST Inc.

BGA Reballing Services

BGA Reballing Services

Videos

EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:

BEST Inc.


0.2mm pitch bga searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling Machine with CE

Training online, at your facility, or at one of our worldwide training centers"
Potting and Encapsulation Dispensing

High Throughput Reflow Oven
IPC Training & Certification - Blackfox

World's Best Reflow Oven Customizable for Unique Applications
Voidless Reflow Soldering

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...


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