New SMT Equipment: 002 backward temp (9)

Solder Spheres and Fluxes

Solder Spheres and Fluxes

New Equipment | Solder Materials

For BGA's and PCB Production and Rework Sphere Accurate to +/- .001, All standard sizes available Standard Sizes of Sphere's: .035" +/- .002 10SN/90PB High-Temp .030" +/- .001 63SN/37PB .022" +/- .001 63SN/37PB .016" +/- .001 63S

HEPCO, Inc.

Thin Core Copper Clad Laminate FR4 & Prepreg

Thin Core Copper Clad Laminate FR4 & Prepreg

New Equipment |  

170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T

Mica-AVA (Far East) Industrial Ltd

Electronics Forum: 002 backward temp (14)

Pb Free BGA Backward Compatibility

Electronics Forum | Sun Mar 31 00:42:09 EDT 2013 | dhanish

Why we cannot run Pb Free BGA with Sn/Pb process but we can run high temp BGA(90/10) with Sn/Pb? Both require high temperature to form the IMC.Why there is a difference in the reliability?

Hybrid reflow profiles

Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol

for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e

Used SMT Equipment: 002 backward temp (4)

BTU Pyramax 98A Reflow Oven

BTU Pyramax 98A Reflow Oven

Used SMT Equipment | Soldering - Reflow

BTU Pyramax 98A IBE SMT Inventory ID : 101014-002 BTU Serial Number : NRM-9 Vintage : JUN 2006 Details Edge Rail Conveyor Center Board Support Includes Tek Temp TKD-100 Chiller 480 VAC 73 kVA Click Here for m

IBE SMT Equipment

Agilent E4438C

Used SMT Equipment | In-Circuit Testers

Key Features & Specifications: Signal characteristics 250 kHz to 3 GHz +17 dBm output power Modulation and sweep AM, FM, øM, and pulse ASK, FSK, MSK, PSK, QAM, custom I/Q Step, or list, frequency and power Baseband generation and signal

Recon Test Equipment Inc.

Industry News: 002 backward temp (3)

IPC Honors 66 Members at IPC SMEMA Council�s APEX� 2003

Industry News | 2003-04-17 11:35:44.0

Honored for their contributions to IPC and the electronics industry

Association Connecting Electronics Industries (IPC)

SemiPack Invests in Additional Hentec/RPS Photon Steam Aging System

Industry News | 2021-05-18 14:19:48.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Parts & Supplies: 002 backward temp (16)

Juki E3051729000 Z SLIDER SHAFT JUKI

Juki E3051729000 Z SLIDER SHAFT JUKI

Parts & Supplies | Chipshooters / Chip Mounters

E3051729000 Z SLIDER SHAFT JUKI E3044802000 CNB INNER BLOCK E30448020A0 CONNECTOR BLOCK ASM. E30457000A0 STOPPER PLATE ASM E3045706A00 REEL PRESSER SHAFT 12 E3045715000 NOZZLE SPRING 01 E3045729000 Z SENSOR DOG E3045802000 CNB PUSHER PLATE E

ZK Electronic Technology Co., Limited

Juki E3051729000 Z SLIDER SHAFT

Juki E3051729000 Z SLIDER SHAFT

Parts & Supplies | SMT Equipment

E3051729000 Z SLIDER SHAFT E3044802000 CNB INNER BLOCK E30448020A0 CONNECTOR BLOCK ASM. E30457000A0 STOPPER PLATE ASM E3045706A00 REEL PRESSER SHAFT 12 E3045715000 NOZZLE SPRING 01 E3045729000 Z SENSOR DOG E3045802000 CNB PUSHER PLATE E30467

ZK Electronic Technology Co., Limited

Videos: 002 backward temp (6)

Dinghua DH-G730 automatic iphone mobile phone IC soldering station BGA desoldering rework machine

Dinghua DH-G730 automatic iphone mobile phone IC soldering station BGA desoldering rework machine

Videos

1.Product parameter Total Power 2500W Top heater 1200W Bottom heater 1200W Power AC110~240V±10%     50/60Hz Operation mode

Shenzhen Dinghua Technology Development Co., Ltd.

SparkFun LEADSMT Stencil Printer

SparkFun LEADSMT Stencil Printer

Videos

A sneak peek at SparkFun's new LEADSMT Stencil Printer Tags: Business Talent: Robert Hunke

ShenZhen Leadsmt Technology Co.,Ltd

Career Center - Resumes: 002 backward temp (1)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Express Newsletter: 002 backward temp (84)

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267

HALT Testing of Backward Soldered BGAs on a Military Product

HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu

Partner Websites: 002 backward temp (37)


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