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High Force ACF Bonder

High Force ACF Bonder

New Equipment | IC Packaging

Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha

Finetech

Nordson DIMA Launches New Website to Promote Hot Bar Soldering and Bonding Capabilities for the Electronics Industry

Industry News | 2017-07-17 19:09:09.0

Nordson DIMA has launched a new web site, www.nordsondima.com. The newly designed site makes it easier for visitors to learn about Nordson DIMA's full line of hot bar reflow soldering, heat seal bonding, ACF laminating, and heat staking solutions. A second website, www.dimadispensing.eu, was updated to cover the dispensing product lines that are exclusively available for the European region.

C-Tech Systems, B.V. [formerly Nordson DIMA]

Toddco General, Inc. TG-1000 Hot Bar Bonding System for large displays and substrates

Industry News | 2014-08-16 17:55:06.0

Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.

Toddco3

GETECH Announces Partnership with pb tec solutions GmbH

Industry News | 2015-10-21 11:40:16.0

GETECH is pleased to announce it has partnered with pb tec solutions in Germany and Austria to market and sell its range of depaneling and marking systems.

GETECH AUTOMATION

Nordson DIMA hot bar soldering solutions, fluid dispensing, and coating systems to be demonstrated at SMT Hybrid 2018

Industry News | 2018-06-04 18:24:29.0

Nordson DIMA, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit a range of products for hot bar soldering, as well as fluid dispensing and coating systems, at SMT Hybrid 2018 in Nuremberg, Germany, June 5-7, 2018, in the AAT Aston GmbH stand, Hall 4, booth 241.

C-Tech Systems, B.V. [formerly Nordson DIMA]

TG-1000 Hotbar Bonding System for Small Displays and Wearable Products

Industry News | 2017-05-26 14:54:11.0

Versatile Hotbar Bonding System with Motorized Rotary Table for Precision Positioning

Toddco3

Bonding Platform FINEPLACER� Micro MA � Accuracy Meets Flexibility

Industry News | 2007-11-27 12:13:09.0

FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.

Finetech

Nordson DIMA introduces new inline concept for hot bar bonding and soldering at Productronica 2017

Industry News | 2017-11-08 15:24:31.0

Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.

C-Tech Systems, B.V. [formerly Nordson DIMA]

Precision Dicing Blades

Precision Dicing Blades

New Equipment |  

We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress

Dicing Blade Technology

Nordson to exhibit many new solutions for electronics manufacturing at Productronica 2017

Industry News | 2017-11-07 17:14:32.0

Nordson Corporation (NASDAQ: NDSN) announces that eight divisions from its Advanced Technology segment will be exhibiting together at Productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, stands 245, 345, and 445.

Nordson Corporation


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