Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Industry News | 2020-06-11 06:23:00.0
Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.
Industry News | 2021-10-11 16:08:26.0
SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.
Industry News | 2009-06-02 14:13:36.0
With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
Industry News | 2012-02-22 01:47:58.0
Nihon Superior will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo.
Industry News | 2018-08-29 08:53:33.0
Modern dispensing technology protects the electronics in vehicles from moisture, dust and extreme temperatures. NEUSTADT/DONAU. It runs with no emissions, it’s completely autonomous and, what’s more, it’s networked with the entire world – this is what the car of the future will look like. Thanks to rapid advances in the field of electronics, the vision of a (fully) autonomous vehicle, which appeared unrealistic just a few years ago, is now within reach.
