Industry News | 2015-02-17 10:38:29.0
At IPC APEX 2015 Digitaltest are showing the integration of all test processes to accurately locate defects, increase fault coverage, provide the focus to improve your process and increase quality.
Industry News | 2016-01-05 15:27:41.0
Digitaltest will be demonstrating their New Flying Probe and Reverse Engineering Software at the IPC Apex show in Las Vegas, NV, Booth 1547, March 15th to 17th, 2016.
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Fri Apr 27 12:38:40 EDT 2007 | Cal
Basem, I worked directly with both Essemtec and Dima and if you send me an email I can help provide direction. cal_Driscoll@hotmail.com Unfortunately,I have been out of the SMT world for almost 4 years now. I would lean more towrds the Essemtec as
Electronics Forum | Tue Jan 17 12:25:56 EST 2006 | Cmiller
Pete C, this forum has no value if people do not share thier real world experience. We can all do research on our own. We can all make bad decisions or good decisions based on that research because most of the data we have access to comes from the pe
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
