Electronics Forum | Tue Dec 17 17:22:45 EST 2002 | Tim Marc
Thanks Russ. You were right I looked one page too far. We can meet (A,B,C,D). To meet the 75% of (E) the annular ring will have to be scraped. Your help was much appreciated.
Electronics Forum | Wed Apr 15 10:27:20 EDT 2009 | mbohuslav
I am trying to find out what would be considered the minimum test via that would be considered reliable for Flying Probe testers. Specifically Javelin testers. Also what would the minimum annular ring need to be.
Electronics Forum | Wed May 09 11:25:29 EDT 2001 | medernach
What type of preheaters do you have on you're wave? I have to agree with Dave. Your leads are not cold, they are hotter than the annular ring on the PCB. This would cause the solder to go to the lead only rather than the component and land pad / a
Electronics Forum | Wed Jul 20 15:05:28 EDT 2005 | Fred M.
With the new rev D release of IPC-A_610 came a new section 10.2.9.3 which identifies a via (through hole) with nicks along the inside of the annular ring. Defect is all three classes and states "Damage to conductor or lands". We have for years defa
Electronics Forum | Thu Feb 12 17:14:49 EST 2004 | Jim
Replying to mine own thread for clarification. We are having some issues with solder mask shifts on memory boards using fine pitch BGAs. At times the etch to etch distance does not leave room for a solder mask annular ring to be shifted or it will c
Electronics Forum | Tue May 10 10:30:57 EDT 2005 | HOSS
One failure mode we have seen with TH XTALs is shorting from one of the leads to the metal can that houses the part. Typically, the opening around the lead at the base of the part can be small and if you combine this with a larger than needed annula
Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett
Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t
Electronics Forum | Thu Nov 08 13:12:02 EST 2007 | russ
Annular rings are too big, it is acceptable to have shorts on the common conductors. I would be willing to say the "other" supplier may have modified the artwork as well. Good fluxing, preheat and proper immersion depth are key to eliminating short
Electronics Forum | Wed Oct 21 08:06:06 EDT 2009 | scottp
I agree with Dave. If the device has a lot of power we'll put thermal vias between the solder deposits with annular rings of soldermask to keep solder out of the holes. We've never had to mess with placement pressure. We've been using QFNs for yea
Electronics Forum | Tue Jun 05 02:22:07 EDT 2012 | vileo72
Dear Dave/pr/Reese, Thank you so much for the information and this will certainly help me to align on the query .Would like to know further :During Flying probe testing the vias are also observed that they have pin mark on the annular ring due to the
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