Electronics Forum | Thu Oct 18 12:15:03 EDT 2018 | teresat2
The numerous traits of an electronic assembly comprise high volume assembly, BGA, AOI and 3 dimensional solder paste inspection. The value incorporated features of these assembly services comprise low loss, blended technology assembly, many layer, du
Electronics Forum | Thu Aug 29 06:39:29 EDT 2013 | claudiagreene
Many China PCB factories don't have the lamination equipments. Usually,they will send pcbs inner layer finished to other big factory or the lamanation factory to complete this process.It seems it is not what you like. But it is common... Is it ok for
Electronics Forum | Wed Aug 09 19:14:15 EDT 2006 | Board House
Our Manufacturing policy regarding welds is as follows. 1) Inner layers - depends on Core thickness and line width. Our shop will not do any welding on core thickness less then 5 mils. or line width less then 5 mil. Good AOI practices reduce the a
Electronics Forum | Tue Jul 10 19:16:08 EDT 2007 | 5why
We have filed returned (approx. 5%) of the boards that exhibit inner layer short @ a particular connector locations. X-section revealed there exhibit Cu residue, but aside from that, we also suspect there could be organic contaminant, what test shou
Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
