Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Tue Apr 27 12:01:10 EDT 2004 | Dreamsniper
Hi, Can anyone help me as to what is acceptable and reject when it comes to solder balling under BGA's? I've got some BGA's with solder Ball but they seemed to be attached and they are about 10% of the size of the actual soldered BGA joint size. Our
Electronics Forum | Wed Oct 20 13:53:22 EDT 2004 | Greg D
Hi, What's the maximum and minimum solder void that can be accepted during X-ray? What about the percentage of Ball Roundness..20%? 30%? thanks and regards,
Electronics Forum | Thu Jan 31 15:31:00 EST 2013 | rjohnston58
Are the conditions (Bullets) under the IPC Acceptable and Defect sections "ANDs" or "ORs"? In other words, does every condition under a section must be meet to be Acceptable/Defect or meeting any one condition suffices?
Electronics Forum | Fri Oct 23 15:43:31 EDT 2009 | seankim10
According to 5.2.6.1, it states that defected if Solder balls are not entrapped in no-clean residue or conformal coating. How do you define entrapment or how do you assess if the balls won't dislodge under normal product service environment? The sold
Electronics Forum | Fri Jul 12 03:05:30 EDT 2002 | Dreamsniper
Is there a standard with regards to the height of a PBGA ball diameter that will say that it has undergone a double drop ? What is the criteria of identifying that a PBGA solder ball has done a double drop and that it is acceptable or not acceptable.
Electronics Forum | Thu Jan 31 10:20:04 EST 2013 | rjohnston58
Need your help with a referee call on solder balls. See attached pictures. Engineering believes the solder balls and splash in pictures violate IPC-A-610E-2010 section 5.2.7.1. Purchasing on the other hand believes these are acceptable. Info: balls a
Electronics Forum | Fri Oct 30 10:36:26 EDT 2009 | richie_puthotta
Hi, I see a huge solder mask shift on chip comp pads. This would result in mid-chip solder balls or solder beads. Overall, the solder mask workmanship is not acceptable. Mask is on pad.
