Industry News | 2009-09-17 14:59:53.0
TORRANCE, CA — September 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will highlight Sayaka’s Table-Top Router, Hirox’s 3-D Microscope and the McDry MB-302 Low Temp Baking Cabinet in booth 617 at the upcoming SMTA International exhibition and conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2011-12-30 23:20:54.0
SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK.
Industry News | 2011-11-27 00:32:29.0
Data I/O Corporation has partnered with Aegis to deliver comprehensive solutions for end unit traceability, process tracking, and quality management.
Industry News | 2009-03-02 00:10:24.0
TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.
Industry News | 2013-01-16 13:59:39.0
Seika Machinery, Inc., will showcase its proven, advanced machinery in booth #2727 at the upcoming IPC APEX EXPO
Industry News | 2016-03-03 08:27:28.0
Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
Electronics Forum | Wed Jul 20 10:07:05 EDT 2005 | cecil
Does anyone have any input on the need to bake out an assembly prior to the conformal coat process? I understand baking out components/pwb's prior to processing through the reflow or wave solder process if the material shows excess moisture absorbtio
Electronics Forum | Wed Jul 20 15:18:35 EDT 2005 | FW
Hi! We have both Dip & Spray conformal coating processes & have never done any kind of baking before the process! I am assuming the reason for baking would be the same - ie, remove any moisture on the brds since moisture will create failure of the co
