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Latent shorts on QFN package

Electronics Forum | Fri Mar 06 10:32:34 EST 2009 | fountain42

Yes, We've already experienced this same problem. 1) What kind of flux are you using? No Clean? Rosin? OA? 2) If it's OA, What kind of water wash do you do? Do you use DI water? How Hot? Who's machine? What are the pressures? 3) Have you performed a

Re: Solderability on Immersion Gold

Electronics Forum | Wed Mar 01 17:03:56 EST 2000 | Dave F

Steve: Someone is trying to trick you. He/she is trying to be very smart, but he/she didn�t anticipate this "dark haze" coating problem. I suspect that this person is someone you speak with every day in your plant. They may be the one that came-u

Re: no tru-hole on wave

Electronics Forum | Mon Aug 28 15:34:19 EDT 2000 | Steve Harshbarger

Hello Ramon, This is a very common problem that usually can be overcome. Can you tell me the flux type you are using (manufacturer, and flux number)? Has your board vendor, or type of PCB's changed (are they entec coated - bare copper)? What is t

Re: Solderability on Immersion Gold

Electronics Forum | Wed Mar 01 17:03:56 EST 2000 | Dave F

Steve: Someone is trying to trick you. He/she is trying to be very smart, but he/she didn�t anticipate this "dark haze" coating problem. I suspect that this person is someone you speak with every day in your plant. They may be the one that came-u

Conductive filled Vias on BGA

Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef

First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled

SMT on boards with COBs

Electronics Forum | Thu Jul 14 20:16:33 EDT 2005 | Bman

I know what the COB process is, and I have no intention of getting involved with that end of things. I need to know how to place SMT parts on a board with a COB. It looks like the preferred method is to place the SMT parts first, then go through th

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: haloing on SMT PCBs

Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon

| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot

void on BGA Ball due to via on BGA pad

Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef

You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the


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