Industry Directory | Manufacturer
Electronic Assembly Solutions for high mix technology small to medium runs. Top quality with manufacturability engineering ingenuity.
Industry Directory | Consultant / Service Provider / Manufacturer
Full Service Electro Mechanical and Electronic Contract Assembly Services Provider
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Used SMT Equipment | Pick and Place/Feeders
Machine size: length 1500 * width 2000 * height 1500 (unit: mm) Machine structure: 3 groups of placement heads, different nozzles can be replaced automatically Machine specifications: standard version, front loading rack and tube load
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2016-02-27 20:41:52.0
BEST Inc. instructors will be conducting 2 training sessions this year at the APEX Expo 2016 - Advanced Rework: Hands-on BGA Reballing, Lead-Free Devices, and Fine-Pitch Parts, and the 2nd session - Stencil Printing: Consistent Print Volumes for SMT Rework.
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Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Work closely with production department in achieving production targets by continually supporting the production team. Setting up Process parameters for Critical process such as Solder Paste Printing, Reflow Soldering, Wave Soldering, BGA Rework
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Work closely with production department in achieving production targets by continually supporting the production team. Setting up Process parameters for Critical process such as Solder Paste Printing, Reflow Soldering, Wave Soldering, BGA Rework
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
| https://www.feedersupplier.com/sale-13067539-smd-ys12-ys24-ys24s-yamaha-label-feeder.html
: SMD YS12 YS24 YS24S Yamaha Label Feeder Warranty: ONE WEEK Usage: Smt Pick And Place Machine Size: 2 X 2mm Thickness: 0.05mm~1mm Backing Paper Width
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/tape-and-label?con=t&page=35
parts and equipment are designed to improve processes for adhesive tape manufacturers. If you create tape, disposable hygiene products or labels, our applicators can help ensure the backing goes and stays where it’s needed
