New Equipment | Rework & Repair Equipment
Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
High Value Stencil Screen Printing Solutions from JUKI. The PMAXII printers utilize a patented mathematical calculating algorithm to ensure the machine's high accuracy print alignment that easily achieves 01005 (0402 metric) printing. Vision
New Equipment | Rework & Repair Equipment
The EXPERT 04.6 systems with Hot Air and IR Technology are complete rework stations for manual soldering of SMDs, residual solder removal and dispensing. Soldering profiles can be easily established and supported with the supplied software packet Eas
Industry News | 2018-08-14 17:57:21.0
Saki Corporation introduces Saki Self-Programming Software, the first self-programming software for solder paste inspection (SPI) and automated optical inspection (AOI) equipment. Saki Self-Programming (SSP) software, installed on Saki's 3D SPI and 3D AOI systems, makes programming fast, easy, and doesn't require any special programming skill or training. All you need is the Gerber and centroid CAD data. The software does the rest.
Industry News | 2009-09-23 21:53:53.0
Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Industry News | 2023-04-03 13:29:59.0
VJ Electronix, Inc. today announced the launch of its LT120 Rework System. Carrying on the Summit line of highly robust systems, the new LT120 is positioned to be able to work with very large BGA components on large PCBs.
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Industry News | 2003-09-25 13:32:47.0
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