Electronics Forum | Tue Oct 21 07:44:44 EDT 2008 | patrickbruneel
Dave, I know that black pad isn't solderable by any alloy. But it's still justified to relate the nickel barrier plated boards to lead free. Before lead free the predominant board plating was HASL and OSP. These platings disappeared with the switch
Electronics Forum | Thu Aug 21 22:10:07 EDT 2003 | adlsmt
Well, for some reason the board house will pay for the boards but has some issue with paying for the parts on them. Why am I not supprised? Perhaps I have mis-diagnosed the problem. We have found two different board p/n's with the same type of defec
Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny
When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b
Electronics Forum | Thu Sep 18 23:56:56 EDT 2008 | trynders
am having wetting issues with two Burr Brown Op amps. Both are SOICs with NiPdAu lead frame finishes. I have attached a photo that shows a black streak the length of the lead (before soldering). This appearance is consistent of all leads and is exist
Electronics Forum | Tue Aug 20 18:15:02 EDT 2002 | davef
Haaaaa!!!! Soldering to plastic!!!! An apt analogy!!! I like to compare it to soldering to dirt. Some thing. In fact, you are soldering on nickel, when soldering on many things. It�s just that the gold, er Pd, flash enables the wetting mechanism
Electronics Forum | Wed Dec 14 21:19:36 EST 2005 | davef
Heavens to Murgatroyd, we agree with Russ that "black pad" could be the cause of your solderability problem, but oxidized nickel is an additional explanation. While its often easy for assembler to jump this conclusion, it sounds like you've been bla
Electronics Forum | Tue Jan 10 12:53:16 EST 2006 | muse95
There is a tape test from IPC in their TM-650 spec that can be downloaded for free from the ipc website. It will test for gold adhesion to the underlying nickel. Section 2.4.1E, I believe. It is quite simple to perform.
Electronics Forum | Fri Jul 02 05:28:13 EDT 1999 | Vinesh gandhi
| | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design).
Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
