Full Site - : blasting (Page 14 of 16)

How does temperature and humidity effect solder paste/printing

Electronics Forum | Wed Apr 11 22:05:58 EDT 2001 | davef

OA pastes are more hydroscopic than NC pastes. Hydroscopic. The capacity of a material to absorb and retain moisture from the ambient air. Sometimes this is compounded if you remove paste from the frig and let it warm to room temperature, because

Re: Universal FlexJet!!!

Electronics Forum | Wed Mar 31 13:15:43 EST 1999 | John Doe

| | It's unfortunate that there are corporations that exist that would actually hire and employ people of your specimen. You, obviously by your screen name, GSM GURU!, are a complete idiot. I'd like to see you and your idiot brother C4 GSM GURU ter

Re: TCP solder / desolder / rework

Electronics Forum | Tue Jun 09 09:40:47 EDT 1998 | Wolfgang Hantz

| We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | Now,

Re: Nice philosophy

Electronics Forum | Wed Jun 10 14:22:07 EDT 1998 | Chrys

| | We offer an upgrade service for notebooks with 486 SX/DX CPUs up to 586-133 MHz using the AMD 5x86-133 MHz CPU in the PQFP package. We are pretty succesful with this service and until today we did more than 1000 notebook upgrades this way. | | N

Re: Removal of Parylene by Plasma Etching

Electronics Forum | Mon Dec 22 18:20:33 EST 1997 | Graham Naisbitt

Brett and Chis, The method I understand to be the most popular is the use of micro-blasting or abrasion. In other words mechanical rather than chemical removal. However, that is only part of the problem - how do you repair the coating? The technique

Contract Manufacturing

Electronics Forum | Mon Aug 12 09:40:53 EDT 2002 | itempea

Hi Antonio, you had some wonderful input from the previous mailers. They covered much of the technicalities. What I would like to point out is that if the line has 2 chipshooters and they only use one for you, you still pay for the second one since

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS

Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met

Universal Instruments Radial Inserter

Electronics Forum | Thu Aug 02 22:33:24 EDT 2007 | simsj

We've had some experience with Universal's machines as well. Aside from the mechanical problems you're experiencing, that level of control hardware is susceptible to power spikes/fluctuations. Save yourself some trouble later on and get a good UPS.

Non wetting spots of flex PCB pads

Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001

I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te

Solder Paste Pin Transfer vs Time Pressure Dispense

Electronics Forum | Thu Jul 20 13:32:11 EDT 2023 | spoiltforchoice

I doubt either Mycronic or Essemtec, as the only people who do dispense printing, will want to share their research with you. But clearly they will have followed every valid option to determine what is possible. Time & pressure is not used for anythi


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