Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Industry Directory | Manufacturer
Manufacturer of flex, rigid-flex, and rigid circuit boards. We offer prototype and production delivery options. We manufacture commercial, military, medical and industrial jobs and offer value added services such as assembly. We can customize services to fit your needs, such as gold or white tin plating, plugged or blind vias, etc.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
Electronics Forum | Thu Feb 15 12:32:14 EST 2007 | Eric D
one of my customer areworried about the flux risidue in the blind vias, or if the plug the vias and there is air trapped the plug will blow during our process. Appreciate for your response
Electronics Forum | Thu Feb 15 13:49:10 EST 2007 | russ
only plug one side, you can definitely blow out during reflow process with a sealed via/ it is impossible for flux to be trapped in a blind via. Russ
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8350B The totally programmable features and internal memory of the 8350B Sweep Oscillator Mainframe can speed up your repetitious testing needs. A push of a button returns the unit to local control for bench work. Sweep frequency
Used SMT Equipment | General Purpose Test & Measurement
Agilent Keysight E8361A 67 Ghz PNA Network Analyzer This and 400+ other quality test systems available via online auction. Please visit www.xlineassets.com for details. Auction starts soon!!! Equipment Manufacturers: Agilent/HP Tektronix
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Parts & Supplies | Circuit Board Assembly Products
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin
Parts & Supplies | Circuit Board Assembly Products
1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm，6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish
Technical Library | 2020-07-15 18:49:03.0
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias
Technical Library | 2013-03-07 18:25:36.0
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express March 7, 2013, Subscribers: 26214, Members: Companies: 13311, Users: 34412 PTH Core-to-Core Interconnect Using Sintered Conductive Pastes The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias
SMTnet Express, July 18, 2019, Subscribers: 32,162, Companies: 10,836, Users: 24,951 Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution Credits: MacDermid Inc. The increased demand for electronic devices in recent years
Imagineering, Inc. | https://www.pcbnet.com/blog/hdi-pcb-advantages-and-applications/
(High Density Interconnect) technology is increasingly becoming the solution for smaller, more durable, and more efficient PCBs. HDI technology allows for lighter, smaller products that do more faster than ever before by leveraging blind and buried vias that can be staggered, stacked, and integrated with microvias
