Electronics Forum | Mon Nov 25 15:55:32 EST 2002 | davef
Sorry, no tricks for you. The good news is: your reflow recipe should be similar for both imm tin and HASL. Imm tin requires more attention to detail by both the fabricator and the assembler than HASL. There is a fair amount of discussion on imm
Electronics Forum | Wed Jun 21 09:21:37 EDT 2006 | don dawson
I've been building boards for a long time and have never heard of anyone using electrolytic silver. Immersion silver would be 8-18 microinches thick. Plated silver would be significantly thicker (min a couple tenths - .0002" and up). So you may be ab
Electronics Forum | Wed Jun 28 12:37:05 EDT 2000 | Brian W.
HASL plating, by its very nature, is inconsistent in terms of thickness and consistency. The plating varies from spot to spot on the pad, as well as pad to pad. This will wreak havoc on your screen printing process and your placement. From talking
Electronics Forum | Wed Jan 24 11:27:54 EST 2007 | bradlanger
We have been using SN100C lead free hasl for over a year now with good success. It is very solderable and has good shelf life. You do have to make sure the finish gets applied to the correct thickness. If the lead free hasl finish is not applied thic
Electronics Forum | Tue Jun 28 13:23:56 EDT 2005 | Bob Gilbert
Matt, Try a cooler profile by simply speeding up the conveyor by 10%. The difference may be the temperature the pads are reaching between the HASL boards and the Au boards. Are they the same thickness?
Electronics Forum | Mon Feb 14 02:59:03 EST 2000 | Joe
check the solderablity of the board and the thickness of the solder before screening, if you are using HASL finished boards.
Electronics Forum | Fri Sep 24 10:57:18 EDT 1999 | Earl Moon
| Hi Folks: | | We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. | | The bridging is happening after coming out of reflow...one la
Electronics Forum | Fri Oct 15 17:11:45 EDT 2004 | HOSS
Matt, Had a similar problem with HASL that wasn't fluxed properly during fab. The appearance of the HASL looked dull and/or mottled (sp?). Solder was curled under on the edges where it should have been smoothly joined to the pad. Almost like a pu
Electronics Forum | Tue Apr 03 11:08:21 EDT 2001 | vsorin
Hi, Our engineering board has to decide which technology is better for the hand soldering of the SMT components: HASL or Chemical Ni-Au. We have an automatic line for SMD assembling and our experience shows us that for this automatic line is better
Electronics Forum | Fri Jul 15 16:27:55 EDT 2005 | davef
It depends on how much paste you put on the pads. Assuming your stencil is 1:1 to the pad and the solderability protection on the board is something other than HASL, we'd guess that your solder height is approximately 50% of your stencil thickness,
