This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
New Equipment | Test Equipment
Military-style laboratory services to validate bare boards for product assurance. Testing for delamination, voids, copper thickness, hole quality, proper stack-up, etc. Customer receives all cross-section pucks, boards and laboratory report with reco
Technical Library | 2024-09-02 17:01:54.0
A printed circuit board (PCB) is an integral component of any electronic product and is among the most challenging components to recycle. While PCB manufacturing processes undergo generations of innovation and advancement with 21st century technologies, the recycling of PCBs primarily employs 1920's shredding and separation technologies. There is a critical need for alternative PCB recycling routes to satisfy the increasing environmental demands. Previous work has developed an environmentally benign supercritical fluid process that successfully delaminated the PCB substrates and separated the PCB layers. While this work was successful in delamination of the PCB substrates, further understanding is needed to maximize the interactions between the supercritical fluid and PCB for an optimal processing scenario. As such, this research presents an exploratory study to further investigate the supercritical fluid PCB recycling process by using supercritical carbon dioxide and an additional amount of water to delaminate PCB substrates. The focus of this study is to test delamination success at low temperature and pressure supercritical conditions in comparison to the previous studies. Furthermore, material characterization methods, such as differential scanning calorimetry, dynamic mechanical analysis, and Fourier transform infrared spectroscopy, are included to study the delaminating mechanisms. Results from the recycling process testing showed that the PCB substrates delaminated easily and could be further separated into copper foils, glass fibers and polymers. Surprisingly, the material characterization suggested that there were no significant changes in glass transition temperature, crosslink density, and FTIR spectra of the PCBs before and after the supercritical fluid process.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Technical Library | 2024-09-02 21:02:46.0
In conformal coating, there are several mechanisms that cause failure of printed circuit boards (PCBs). In a series of technical bulletins SCH will examine the common failure mechanisms in conformal coating including capillary flow, delamination, cracking, loss of adhesion, dewetting, corrosion, orange peel, pinholes, bubbles and foam.
Industry Directory | Manufacturer
PCB Repairs of all kinds including-Solder on Tab (Solder Removal, Gold Plating), PTH & Delam repairs, etc.
Technical Library | 2024-09-02 17:31:09.0
The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure, such as reflow and rework, have always been a concern for the electronics industry. However, with the increasing spread of Pb-free assembly into industries with lower volume and higher complexity, the occurrence of these events is increasing in frequency. Several telecom and enterprise original equipment manufacturers (OEMs) have reported that the robustness of their PCBs is their number one concern during the transition from SnPb to Pb-free product. Cracking and delamination within PCBs can be cohesive or adhesive in nature and can occur within the weave, along the weave, or at the copper/epoxy interface (see Figure 1). The particular role of moisture absorption and other PCB material properties, such as out of plane expansion on this phenomenon is still being debated.
New Equipment | Cleaning Equipment
WHAT IS THE PRECISION MATERIAL REMOVAL SYSTEM™ (PMRS)? The Precision Material Removal System (PMRS) is a multi-faceted system designed to be effectively used in three different applications: 1/ Conformal coating removal 2/ PCB Delamination
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
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