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IPC J-STD-001 Space Addendum Trainer (CIT) Certification Training Course

Training Courses | | | IPC J-STD-001 Space Trainer (CIT)

The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.

Blackfox Training Institute, LLC

Point-of-load Convertors Extend to 40W

Industry News | 2003-03-06 08:10:20.0

Astec Power has expanded its popular APC-Centauri surface-mount product line to include a series of 40W point-of-load DC/DC convertors.

SMTnet

Terminal Blocks Handle the Hazards

Industry News | 2003-04-14 08:50:52.0

Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.

SMTnet

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Three Sun Multilayer PCB Accommodates 0.5mm(�) Holes

Industry News | 2003-05-19 10:06:43.0

The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.

SMTnet

DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

SMTnet

For Electronics, Phoenix Contact has Professional Housings

Industry News | 2003-06-03 08:20:48.0

Designed for fast and easy DIN-rail mounting

SMTnet


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