Full Site - : bondability of gold (Page 16 of 18)

Re: Tin Immersion (Dexcoat FST) instead of HASL for SMT assembly.

Electronics Forum | Thu Feb 19 12:35:13 EST 1998 | Earl Moon

| | We are currently investigating alternatives to HASL for circuit boards with 20 mil pitch smt pads and below. If you have experience with this product or simular immersion tin products with respect to manufacturing or assembly I am very interest

PC Assembly of 0.5mm pitch array Chip Scale Package with HASL fi

Electronics Forum | Thu Dec 18 23:44:53 EST 2003 | Dean

...don't expect high yields with hasl on that device. Yeah, you an do it. But not reliably. Also, factor in board warp, bump tolerance AND HASL variation....recipe for disaster. can your process toleate a selective gold on the one device? How ab

Solder climbs on the lead and touches the body of the component

Electronics Forum | Mon May 12 12:58:07 EDT 2014 | emeto

Hello all, I have a diode(gold plated)on some assemblies that gives me a a hard time. The paste is wetting too good and climbs the lead of the component and touches the body which is a defect. I just wonder what if there is a way to heat the board e


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