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Nordson ASYMTEK's Qadence™ Closed-loop Flow Control Automatically Compensates for Viscosity Changes during Conformal Coating

Industry News | 2019-10-15 14:59:59.0

Nordson ASYMTEK introduces Qadence™, a closed-loop system that automatically compensates for viscosity changes during conformal coating. This innovative system combines the capabilities of Nordson ASYMTEK's conformal coating hardware and software to selectively apply coating to specific areas of a circuit board consistently throughout production. The Qadence flow control system maintains stable fluid application, flow rates, and performance by automatically compensating for viscosity changes related to temperature, humidity, and batch-to-batch variation. It eliminates the need for frequent operator adjustments and downtime to recalibrate the process.

ASYMTEK Products | Nordson Electronics Solutions

IPC Releases Book-To-Bill Ratios For February 2001

Industry News | 2001-03-27 09:45:52.0

IPC today announced the U.S. Printed Wiring Board Industry Book-to-Bill Ratio for February 2001 was 0.79.

Association Connecting Electronics Industries (IPC)

IPC Releases Book-To-Bill Ratios For September 2001

Industry News | 2001-10-26 17:06:02.0

IPC today announced the U.S. Printed Wiring Board Industry Book-to-Bill Ratio for September 2001 was 0.89. Sales billed (shipments) in September 2001 decreased 41.6% over September 2000 and orders booked decreased 56.1% over September 2000.

Association Connecting Electronics Industries (IPC)

IPC Releases Book-To-Bill Ratios For October 2001

Industry News | 2001-11-27 07:58:39.0

IPC today announced the U.S. Printed Wiring Board Industry Book-to-Bill Ratio for October 2001 was 0.86. Sales billed (shipments) in October 2001 decreased 47.5% from October 2000 and orders booked decreased 51.8% from October 2000.

Association Connecting Electronics Industries (IPC)

IPC Releases New Industry Statistics

Industry News | 2001-12-12 07:28:23.0

IPC has announced the creation of the PCB Business Report, a new IPC statistical report tracking the dynamics of the U.S. Printed Circuit Board industry. The PCB Business Report, scheduled to be published for the first time on February 28, 2002, will be presented monthly, in addition to the IPC Book-to-Bill ratio.

Association Connecting Electronics Industries (IPC)

IPC Releases Book-To-Bill Ratios For November 2001

Industry News | 2001-12-27 10:09:51.0

IPC today announced the U.S. Printed Wiring Board Industry Book-to-Bill Ratio for November 2001 was 0.87. Sales billed (shipments) in November 2001 decreased 53.2% from November 2000 and orders booked decreased 57.1% from November 2000. Compared to 2000, bookings of PWBs are down 50.2% year-to-date, while shipments of PWBs are down 30.8% year-to-date.

Association Connecting Electronics Industries (IPC)

Library Expert Professional is now FREE

Industry News | 2018-02-01 02:56:53.0

More is not less, rather more is completely free. These newly released features were originally available to our enterprise-level customers, and now available at absolutely no cost, no obligation, no strings attached, to automate creation of tens of millions of parts...

PCB Libraries, Inc.

SMT Processes Certification, Harsh Environments Conference Coming to Amsterdam

Industry News | 2022-02-25 13:16:27.0

The SMTA is pleased to announce an SMT Processes Certification Program is scheduled for May 16-18, 2022 in Amsterdam, Netherlands. Keith Bryant, KB Consultancy, will instruct the program. The program is co-located with the Electronics in Harsh Environments Conference taking place May 17-19, 2022.

Surface Mount Technology Association (SMTA)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)


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