Industry News | 2018-09-04 15:51:06.0
YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.
Overview The USB 2.0 Mass Storage Design Platform is a complete, integrated solution dedicated to use in wide range of USB based Mass Storage Devices like portable flash memory device, digital audio player, card reader or digital camera. Features
KE-3020V represents the latest leading-edge technology for improved flexibility and production quality. Higher Speed, Higher Quality, Improved Capacity. The KE302V is a 7th generation modular placement machine from Juki and represents the latest lea
Overview • two software-controlled power-saving modes • ADC Controller • integrated on-chip major peripheral functions D68HC11E can be used as a direct replacement for: • 68HC11E Microcontrollers and older 68HC11E versions: • 6
Overview • 4 times faster compared to original implementation • the best power use, price and performance combination • advanced power saving SLEEP mode The DRPIC1655X is a low-cost, high performance, 8-bit, fully static soft IP Core, intende
Overview • 2 times faster compared to original implementation • 35 instructions • 14 bit wide instruction word The DFPIC1655X is a low-cost, high performance, 8-bit, fully static soft IP Core, intended to operate with fast memory. The core ha
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2011-10-28 20:29:08.0
ERSA is pleased to offer a free ERSA Mobile Scope with the purchase of an ERSA rework system. The ERSA Mobile Scope is a new portable video microscope designed to inspect hidden solder joints of ball grid arrays (BGAs), μBGAs, chip scale packages (CSPs) and flip chips.
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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