Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange
| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic
Electronics Forum | Tue Nov 24 11:13:11 EST 1998 | Keith
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
Electronics Forum | Wed Jul 24 22:24:07 EDT 2013 | mac5
When we first got our XP1’s the cycle steal was on a schedule. We would have boards running good and then start placing off in the middle of a run. We finally noticed that the cycle steal had run just prior to the parts being misplaced. We have turne
Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
Electronics Forum | Mon Mar 30 16:02:44 EST 1998 | Michael Allen
| We have successfully put .016" vias in .030" pads. | There is no issue with .030" solder balls, since | the actual volume of the .002" via in pad is small | compared to the ball+solder paste volume. | We did notice random bubbles where, apparentl
Electronics Forum | Thu Feb 20 12:59:29 EST 2003 | gregp
Claude, I know alot of equipment manufacturers that would like to talk to you about replacing all of your chipshooters! Of course, this will never happen. There probably won't be any sold until all of the used chipshooters are absorbed from the use
Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach
| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?
Electronics Forum | Wed Nov 09 11:01:41 EST 2005 | DannyJ
Hi Red and Greg, First, to Avalancher, the service that is mentioned is fantastic. I have used it various times with various connectors and headers with fantastic results. Just contact MyData and they'll tell you what they need. It's usually 5-1
Electronics Forum | Wed Nov 25 12:33:16 EST 1998 | Scott Snider
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
