Industry Directory | Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
Manufactures and Provides: thermal interface materials (TIM) including insulated-metal-substrates, gap-filling compressible phase-change pads, thermal gels-greases,(EMI/RFI) mitigation conductive gaskets and other products.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
Electronics Forum | Fri Jan 11 06:38:58 EST 2019 | tirthkar8980
what is the standard for pad size of SMD chip type components
Electronics Forum | Sat Jan 12 01:25:53 EST 2019 | tirthkar8980
Respected sir, thank you so for useful information. Thank you, Tirthkar
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine TP400V is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0603、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision
Used SMT Equipment | Pick and Place/Feeders
Automatic pick and place machine 210 is the high cost-effective equipment in the market, it can pick and place variety of components by its vacuum nozzle. The machine can mount 0402、 SOIC、PLCC、QFP IC and many SMD chip components; optional vision pos
Industry News | 2003-04-21 10:24:56.0
Learning today for tomorrow's demands
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Parts & Supplies | SMT Equipment
500/501/502/503/504/505/506/507/508 series nozzle for SMT JUKI machine KE2010——2040 PART No. PART NAME SIZE(mm) REMARKS E3608-729-0A0 #500 ASS'Y(2-HOLES) 0.5/1.0 E3600-729-0A0 #501 ASS'Y φ0.7/φ0.2 E3601-729-0A0 #502 ASS'Y φ0.7/φ0.4 E3602-729-0
Parts & Supplies | SMT Equipment
500/501/502/503/504/505/506/507/508 series nozzle for SMT JUKI machine KE2010——2040 PART No. PART NAME SIZE(mm) REMARKS E3608-729-0A0 #500 ASS'Y(2-HOLES) 0.5/1.0 E3600-729-0A0 #501 ASS'Y φ0.7/φ0.2 E3601-729-0A0 #502 ASS'Y φ0.7/φ0.4 E3602-729-0A
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Wellsboro, Pennsylvania USA | Engineering
SMT PROCESS ENGINEER: (Wellsboro, PA) - Designs, defines and plans the manufacturing process. Specifies and directs installation of new processes. Plans equipment build schedules and monitors vendor progress. Defines and recommends equipment, methods
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
| http://etasmt.com/cc?ID=te_news_bulletin,23571&url=_print
Tombstoning -PCB Soldering Problems-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_convex-resistor-chip-array_topic2437.xml
PCB Libraries Forum : Convex Resistor Chip Array PCB Libraries Forum : Convex Resistor Chip Array This is an XML content feed of
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
winsouce.jpg)
