Used SMT Equipment | Board Cleaners
The Branson Precision Cleaning Division of Branson Ultrasonics Corporation introduces an EVD Ecological Vapor Degreaser. The EVD is a non-aqueous single-chamber cleaning system, providing continuous, closed-loop regeneration of cleaning liquid by vac
Used SMT Equipment | Board Cleaners
Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system. The SMT series cleaners utilize a combination of convection and radiant heat t
New Equipment | Cleaning Equipment
Digicom Electronics’ Diamond Track Cleaning Process, winner of the 2012 Global Technology Award, is a highly efficient, in-line cleaning system aimed at mitigating failures caused by contaminated PCBs. Our innovative Diamond Track Cleaning Process use
Over the past 60 years, Epec has emerged as a leading provider of time-critical, high performance printed circuit board solutions. Our more than 1000 active customers represent a wide range of leading original equipment manufacturers (OEM) and elec
Industry News | 2008-03-12 16:21:20.0
Rancho Cucamonga, CA - March 2008 � Aqueous Technologies Corp. announces that it will exhibit the C3 Cleanliness Tester in booth 2431 at the upcoming APEX 2008 exhibition and conference scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2009-11-01 00:33:04.0
RANCHO CUCAMONGA, CA — October 2009 — Aqueous Technologies Corp. announces the introduction of a full-service contract defluxing and cleanliness testing service in its Southern California facility. Aqueous Technologies’ fleet of award-winning Trident automatic defluxing equipment and Zero-Ion Resistivity of Solvent Extract (ROSE) testers are available for use on any assemblies.
New Equipment | Cleaning Equipment
World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz
Technical Library | 2019-08-14 22:20:55.0
Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.
Technical Library | 2020-11-04 17:57:41.0
Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
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