SMT and COB contract manufacturer, Sapphire,Topaz,AB559A and other equipment
Industry Directory | Manufacturer
SMT,COB,FLIP CHIP,MCM Assembly. Prototype thru Production.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Wed Jun 28 22:21:39 EDT 2000 | Peter Lopez
I trying to find out information on how a normal process will look like with COB's. Questions I'm trying to answer are... Are SMDs and COBs normally on the same side? If yes, SMDs will be place first then the COB's. Is this assumption true? How
Electronics Forum | Wed Aug 07 10:47:02 EDT 2002 | hanson
would you like to tell me about COB Process ?TKS
Used SMT Equipment | SMT Equipment
1 Unit Panasonic TB33C-ST COB/TCP Bonder for immediate sale. Please contact us if interested.
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Industry News | 2012-02-22 01:32:21.0
Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.
Technical Library | 1999-07-21 08:49:49.0
As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability.
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Sun Sep 10 00:00:00 EDT 2017 - Wed Sep 13 00:00:00 EDT 2017 | Warsaw, Poland
EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | , | 2001-05-16 15:58:28.0
Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
Career Center | Gurgaon, India | Engineering,Management,Production,Purchasing,Quality Control
1. Quality Function Management • Ensure timely inspection at incoming, in-process & outgoing stage. • Non-conformance review & reporting. • Decision making - Right disposal of Non-conforming material. • Determination of Vendor Quality rating (VQR
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1020-voids
image of a COB void (red). Sample & Method Many smart cards and hand-held toys use the COB design, where the die is attached and wire bonded directly to the board, then overmolded
Whizz Systems | https://www.whizzsystems.com/package-design-simulation/
. We provide services in different techniques of Package Designing like: Wire Bonding Flip chip We also have expertise in Chip-on-Board (COB) PCB designs
