Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2016-02-16 11:39:48.0
KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at the 2016 IPC APEX EXPO. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Booth #1869, March 15-17, 2016 at the Las Vegas Convention Center.
Industry News | 2017-04-11 21:21:11.0
KYZEN today announced plans to participate in the Contamination, Cleaning & Coating Conference, scheduled to take place May 22-24, 2017 in Amsterdam. The event is co-organized by SMTA and SMART Group. Mike Bixenman, DBA, KYZEN Corporation will present “Development of a Risk Profile from Flux Residues Trapped under Leadless Components” in Session I entitled “Residues Trapped under Component Terminations”. All presentations in this session will address a common question faced by OEMs when designing electronic hardware: How clean is clean enough?
Electronics Forum | Sun Aug 10 03:41:20 EDT 2008 | eyalg
Thanks for your promt reply It was very usefull Eyal
Electronics Forum | Sun Aug 10 03:39:21 EDT 2008 | eyalg
Thanks Pete yes we usu ROHS solder paste in our process. I agree that this termination is more suitable for adhsive bonding rather than soldering. We'll try changing the termination type as you recommended. Eyal G
Electronics Forum | Fri Aug 08 09:49:17 EDT 2008 | scottp
We've seen the exact same problem. The solder joints had negative wetting angles and x-sections show that the PdAg termination dissolved into the solder. We no longer allow PdAg terminations.
Electronics Forum | Thu Aug 07 10:02:10 EDT 2008 | eyalg
We are facing low quality due to soldering opens with coilcraft inductors 0402CS-2N7XGLW. The termination used is(suffix L =RoHS compliant silver-palladium-platinum-glass frit. Did anyone had this problem in the past? Can we do better using T = RoH
Electronics Forum | Thu Aug 07 11:58:36 EDT 2008 | pbarton
We have experienced the same problem with Pd/AG and P/Ag terminations on precision resistive parts. The problem is dissolution of the termination metallisation into the bulk solder. This is exacerbated by the higher thermal profiles required for RoHS
Electronics Forum | Mon Feb 20 08:25:13 EST 2006 | Rob
No problem. If you get no joy you're going to have to change the footprint to a 1206 or 1210. Murata have a range of high Q value inductors (50-60) & from memory Toko used to be pretty hot too. The terminations on the coilcraft part are listed a
