Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe
We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t
Electronics Forum | Wed Jul 08 00:12:20 EDT 2020 | duchoang
Interesting!. They don't look like voids as usual meanings. The "voids" take the whole size of pads. We built millions of BGA, never seen those before. Look like the pads refused to connect with solder paste and pushed the paste away. Pads contaminat
Electronics Forum | Thu Jun 08 10:52:37 EDT 2000 | rolandos1
Hello, My name is Rolando and I want to know more about gold fingers protectors. Our current problem is on SMT line which is used with one board with gold pads and while normal production we get solder paste contaminations on these pads, recently o
Electronics Forum | Wed Apr 21 19:09:10 EDT 1999 | Earl Moon
| | Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proc
Electronics Forum | Fri Oct 05 18:59:53 EDT 2001 | Dan Steffler
I have had an issue where solder has contaminated gold plated pads (fingers) where it is not acceptable. The pads must remain perfectly coplaniar for a LCD zebra strip to lay accross them. Does anyone know of a way to remove the marriage level of s
Electronics Forum | Wed Sep 21 20:03:34 EDT 2005 | kevinbooth
I am going to agree with Rob a little. It is also possible that a internal ground plane might be under or connected to the pads of this cap thus causing a increase in temp to this part during reflow. This can cause parts on occasion to jump from the
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
Electronics Forum | Wed Jun 13 06:42:14 EDT 2012 | brettrenishaw
We have a problem with our Unleaded wave solder machine only randomly soldering some pads. I have looked at the flux level and that appears fine aswell as cheking the preheat and solder height in the bath. The probelm is not exclusive to one perticul
Electronics Forum | Fri Aug 24 11:58:18 EDT 2018 | cupet
Hello davef, thank you for your reply. What do you think about the footprint for the diode on the first picture where the component is not assembled? There is good wetting on one pad of footprint and the other pad has bad wetting. This problem is not
Electronics Forum | Sat Dec 18 01:53:46 EST 1999 | sin
If i have problem with tombstone, first i would look at the placement of my components. if placement is 50% greater on the pad, it would be ok to reflow. even you have bad profile, you would have some other problem not tombstone. then i look at
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