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Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.

HVAC

Industry News | 2021-05-24 04:37:04.0

HVAC stands for heating, ventilation, and air conditioning. This system provides heating and cooling to residential and commercial buildings. These systems use fresh air from the outdoors to provide high indoor air quality. The V in the HVAC or ventilation is the process or replacing or exchanging air within a space.

Quick Time Engineering Inc

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

Toronto Expo

Industry News | 2015-04-28 18:03:55.0

KYZEN is pleased to announce that it will present at the Toronto SMTA Expo & Tech Forum, scheduled to take place Thursday, May 21, 2015 at the Hilton Toronto/Markham Suites Conference Centre in Markham, ON. Dr. Mike Bixenman will present the paper titled “How Clean is Clean Enough?”

KYZEN Corporation

Magnalytix® Co-Inventor Dr. Mike Bixenman to present at SMTA Electronics in Harsh Environments Conference

Industry News | 2022-04-28 14:58:03.0

Magnalytix, the forefront driver in providing real-time reliability solutions for electronics manufacturing, is thrilled to announce that Co-Inventor Dr. Mike Bixenman will present "Electrochemical Reliability of 2-D and 3-D Models as a Function of the Electrical Field Effects" on Tuesday, May 17, 2022, at the Park Plaza Victoria in Amsterdam from 3:30-4 p.m.

Magnalytix

YINCAE's New NC 256 Zero Residue Flux

Industry News | 2019-08-19 15:02:03.0

YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE Advanced Materials, LLC.

SCS to Present Parylene Nanostructures and Coatings at IMAPS Micro/Nano-Electronics Packaging & Assembly

Industry News | 2017-04-22 11:38:03.0

Specialty Coating Systems (SCS) is pleased to announce that it will exhibit at the 2017 IMAPS Micro/Nano-Electronics Packaging and Assembly (MiNaPAD) Forum, scheduled to take place May 17-18, 2017, in Grenoble, France, at the WTC congress center. The company will exhibit its industry-leading Parylene conformal coatings and SCS Vice President of Technology Rakesh Kumar, Ph.D. will present, “Parylene Nanostructures and Coatings for Electronics Applications.”

Specialty Coating Systems

Immersion gold VS Plating gold

Industry News | 2019-05-16 01:27:23.0

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.

Headpcb

Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

Industry News | 2018-02-01 20:18:01.0

Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.

MARCH Products | Nordson Electronics Solutions


contamination golden pad searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155

Pillarhouse USA for handload Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven

High Resolution Fast Speed Industrial Cameras.
Pillarhouse USA for Selective Soldering Needs

High Precision Fluid Dispensers
Fully Automatic BGA Rework Station

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