Industry News | 2023-10-16 12:47:44.0
Scienscope International is about to make history in Hall A3, Stand 103 at productronica 2023, taking place from Nov. 14-17 at the world renowned Messe München in Munich, Germany. This isn't just any exhibition; it's a mind-blowing journey into the cutting-edge world of inspection technology that will leave you in awe.
Industry News | 2015-08-06 08:54:16.0
From strange to familiar; from unquantifiable to impressive, EMA (Electronics Manufacturing Automation) technology, centered on “intelligent manufacturing”, is increasingly promoting renovation and transformation of domestic industrial manufacturing. It is set to lead transformation trends throughout the electronics manufacturing industry for the foreseeable future. NEPCON South China 2015, to be held at the Shenzhen Convention & Exhibition Center from August 25 to August 27, will convene numerous top electronics manufacturing automation suppliers. The event will also examine topical industry issues, with more end users and high-quality trade visitors set to be onsite than ever before.
Industry News | 2018-09-26 14:01:14.0
Horizon Sales is pleased to announce that it was recently awarded ‘Rep of the Year’ for Juki for achieving the highest sales in North America. The award was presented to the Horizon Sales team during the Juki National Sales meeting that took place at Juki’s facility in Raleigh, NC. All of Juki’s representatives from North and South America were in attendance, and honored guests included some of the Juki executive management team from Tokyo.
Industry News | 2010-04-11 03:40:56.0
MILPITAS, Calif. — Bliss Industries Inc., provider of material handling carts and racks for PCB assembly, has awarded Torenko and Associates Representative of the Year for standard products. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2010-04-14 21:28:49.0
Saint-Egrève, France - Vi TECHNOLOGY exhibits its full product range of AOI solutions to reduce defective PCBAs at Nepcon China 2010 at Shanghai, from April 20th to 22nd booth 4F10.
Industry News | 2014-10-29 18:03:49.0
FSInspection, a division of Freedom Scientific, will exhibit at FABTECH, scheduled to take place November 11-13, 2014 at the Georgia World Congress Center in Atlanta, GA.
Industry News | 2019-04-25 12:07:59.0
National Manufacturer’s Representative Firm Added to Channel First™ Program
Industry News | 2021-05-10 02:46:52.0
The SMTA Carolinas Chapter is hosting a ZOOM webinar on May 18, 2021 at 12:00 EST to share insights about the conformal coating evolution.
Industry News | 2023-01-30 17:05:14.0
WPI Vision today announced that it presented three of its manufacturers' representatives with its 'First Out of the Gate Award' during the 2023 IPC APEX EXPO at the San Diego Convention Center in California. Josh Casper of Horizon Sales, Don Dennison of PIT Equipment Services, LLC and Bob Doetzer of Circuit Technology, Inc. were presented with awards and gift cards in recognition of their sales for the new 3D SPECTASCOPE.
Industry News | 2015-12-20 15:16:07.0
Believing that the growth strategy of ASM Assembly Systems has been confirmed, CEO Günter Lauber is optimistic for 2016 despite some risks with regard to the economy. Thanks to strong demand for SIPLACE and DEK solutions, the company became the world’s largest maker of SMT equipment for the first time in 2015. The Smart #1 SMT Factory concept is expected to provide additional impulses for continued growth. At the Productronica show, the industry’s leading trade fair held in November, ASM introduced a series of new platforms, systems and solutions for advanced programming, process integration and material logistics. They enable the customers to move their production one step at a time towards SMT-specific Industry 4.0 concepts that enable them to manufacture with even more flexibility and efficiency. Lauber also believes that his company is perfectly positioned for future technologies in the wafer-based integration of components to form complex modules (such as fan-out WLCSP and system-in-package).
