Full Site - : cooling slope (Page 4 of 4)

via under a smd pad ?

Electronics Forum | Sat Nov 24 15:44:28 EST 2007 | mika

Hi DaveF, I had a short look into the Nr1. IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Most interesting reading, but one thing though, I could not find any information about the oven profile. Just a picture of it. My question is of about the

Re: The best way to erase flux from the golden fingers?

Electronics Forum | Mon Aug 21 20:17:08 EDT 2000 | Dave F

Hey Gyver: Oooow, using a pencil eraser has to take time. I would hate to be the person responding to your customer trying to explain the pencil eraser shreds accidentally left on the board. Awww, just spritz it with DI water and wipe it off with

How to PROPERLY interpet a supplier's paste profile documentation & specification?

Electronics Forum | Tue Dec 24 09:34:55 EST 2013 | emeto

Hi, it is a not given clear here. I will tell you some basics about the profiling: 1. Profile stages A. Preheat - the board preheats from room temp to 130-150C depending on the paste B. Soak - 150-170(or other range depending on the paste). here th

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