Full Site - : copper crack (Page 11 of 20)

Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan

Industry News | 2023-08-29 07:11:55.0

Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.

Indium Corporation

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Indium Corporation Announces SMTA South China Presentations

Industry News | 2021-08-13 08:33:52.0

Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center.

Indium Corporation

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

Re: Plating crack

Electronics Forum | Wed Sep 27 19:37:32 EDT 2000 | Dave F

Wolfgang is correct. Copper plating thickness of the via barrel walls is a key question you need to answer to troubleshoot this. Tenting is a red herring.

Re: Plating crack

Electronics Forum | Wed Sep 27 17:24:08 EDT 2000 | Wolfgang Busko

Ashok: Plating thickness and ductility of the copper are things to look for. If it�s a crack where two layers are pressed together one possible cause could be bad process parameters while pressing these layers together at the PCB shop with the resul

Micro crack for lead free wave solder

Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly

Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity

Re: to seal exposed copper layers

Electronics Forum | Sat Oct 21 03:55:14 EDT 2000 | DL

Dennis, I've seen this before, and in our case we didn't need to seal the edges because there was no concern of shorting or anything in the end product, this is a choice you will have to make, Does your end product have any protrusions or mounting h

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 11:26:23 EST 2005 | CW

How large of chip capacitor can we use reliably? I��ve heard they tend to crack. I��ve also heard if you pre heat the larger chip caps (1812 and above) before vapor phase reflow, they won��t crack. If I use 2 mil copper for a power supply board, a


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