The decision whether to use a Die Collet or a Pick-up Tool is crucial to the success of the die bonding process and we provide custom tools designed for coping with special die geometries and other process limitations. We can design and manufacture
Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | Novi, Michigan USA
Adhesives & Bonding Expo
Events Calendar | Mon Aug 24 00:00:00 EDT 2020 - Fri Aug 28 00:00:00 EDT 2020 | Virtual Event, USA
Adhesives & Bonding Expo Connect
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
Technical Library | 2011-09-08 13:46:10.0
Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly used for connecting displays to pcb’s using anisotropic conductive adhesive and flex foils. For successful implementation there are a few basic constraints. If these are followed, display connection is a simple and reliable process, giving top quality connections. Heat-Sealing can be done in any factory and can be introduced in a few months, from start of design to mass productions
Ejector Pins/ needles are mostly used in die bonding and die sorting process. The needle tip pushes up the die through the expanding adhesive film after dicing for pick up by a collet. Depending on the die size, single pin or more pins (crown needle)
New Equipment | Rework & Repair Equipment
BEST has been designing and fabricating circuit frames for sale and for inhouse use for several years. We have both epoxy and dry film circuit frames- you have the choice! In the dry film adhesive system- damaged pads and traces can be replaced witho
Increased Dispense Area over SD6 Series for Underfill, Glob Top, Dam & Fill, LED Packaging, Surface Mount Adhesive Dispensing, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down
New Equipment | Solder Materials
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process
Our MW Series of ultra soft-fabric wrapped shielding profiles utilises a highly conductive and durable impregnated fabric formed around a sponge or foam core to create a very versatile low compression gasket medium Our MF Series is a range of highl
