Electronics Forum | Fri Dec 10 10:25:59 EST 1999 | Wolfgang Busko
Hi Larry, you might find something looking for the thread "D-Pak misalignment Problem - Kantesh Doss 23:43:23 12/02/1999" Good luck Wolfgang
Electronics Forum | Sun Apr 19 11:19:52 EDT 2020 | davef
A-610G 7.5.16 Components with Bottom Thermal Plane Terminations (D-Pak) says: 100% wetting to land in the end-joint contact area. Is that what you're asking about? Regards, David Fish [davef] Technical Editor & Customer Advocate
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Electronics Forum | Thu Aug 13 16:25:11 EDT 2015 | emeto
Loctite 3609. Just a small dot under the D-Pak and it works 100%.
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Fri Mar 02 12:32:55 EST 2018 | harlymh
Is there a way to make an optical inspection (polarity and shorts test) of a A6284KLPTR-T-1 that has a FK 244 08 D PAK heatsink on top? Is this possible with an AOI 3D Cyberoptics SQ3000? http://datasheet.octopart.com/FK-244-08-D-PAK-Fischer-Elek
Electronics Forum | Fri Dec 17 15:26:48 EST 1999 | Victor Salazar
We use a homeplate design with 80% coverage on the tab, and 100% coverage on the leads 6mil stencil. All of our stencils are laser cut electropolished. We have had good success with this.
Electronics Forum | Fri Dec 03 18:01:56 EST 1999 | M Cox
Usually the alignment problem comes from pad design. The ground pad (largest) is too small. If that is the case (and even if it isn't) try placing a dot of SMT adhesive before placement (it will cure before reflow and hold the part in place). Goo
Electronics Forum | Fri Dec 03 13:29:39 EST 2004 | cyber_wolf
Voids are quite common. You just need to make sure that it is not excessive per your assembly criteria. Take a look at a D-pak under X-ray.
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