Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Seamark provide SMT equipments and services including pick and place machine, solder paste printing, pcb handling, rework and repair, x-ray inspection, soldering material, defects inspection and analysis tool.
Industry Directory | Manufacturer
TMX caters to multiple markets with its EMS / SMT services. We can assist from design through to final logistics stages. Our Juarez location is ideal to ship to both North & South American markets.
Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI 3D Solder Paste Inspection System Model: 4000L 3D SPI Year: 2009 Accuracy and warp compensation Unmatched true resolution, accuracy and repeatability Full-featured absolute measurement of the full board surface, mapping to
Used SMT Equipment | SPI / Solder Paste Inspection
ASC VisionPro M500 3D Solder Paste Inspection System (2019) Brand: ASC InternationalModel: M500 3D Solder Paste Inspection SystemS/N: PSI-107Year: 2019Software: ASCan ULTRA Version 2.4.4.5O/S: Windows 10 Pro System SpecificationsMaximum Object Thickn
Used SMT Equipment | SPI / Solder Paste Inspection
ASC VisionPro M500 3D Solder Paste Inspection System (2019) Brand: ASC InternationalModel: M500 3D Solder Paste Inspection SystemS/N: PSI-107Year: 2019Software: ASCan ULTRA Version 2.4.4.5O/S: Windows 10 Pro System SpecificationsMaximum Object Thickn
Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
Industry Directory | Consultant / Service Provider
SPC software manufacturer. Our software includes such extras as defect tracking, traceability, trend and root cause analysis, overall equipment effectiveness (OEE), rolled throughput yield (RTY), equipment uptime/downtime and supplier quality management in a true real-time production-based system.
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
Technical Library | 2020-07-02 01:14:44.0
Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests.
The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
