Industry News | 2008-10-20 18:25:17.0
HOUSTON � October 2008 � BPM Microsystems announces that its 3000 and 4000 series autohandlers have undergone various improvements in 2008. First developed in 1995 to meet the industry's need of fast, medium to high-volume production programming, the company's automated systems have seen enhancements over the years such as speed increase, support for high density devices, and new input and output media.
The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.
Details Images Features 1. Class leading speed, up to 47,000 cph Maximum speed of up to 47,000 cph*. This is made possible by a revolutionary head design that reduces the travel time and distance for every placement. 2. Optimum
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Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Industry News | 2008-03-09 00:00:43.0
Agilent Technologies Inc. (NYSE: A) today introduced two modules for its Agilent N6700 Modular Power System family that deliver quick and accurate measurements of microamp current for a device under test (DUT). For R&D engineers designing integrated circuits and electronic devices that run on batteries, these power supplies measure current consumption and its effect on battery run time.
Industry News | 2009-11-02 22:48:29.0
HOFFMAN ESTATES, IL — November 2009 — Hattas & Associates, a manufacturers’ representative firm specializing in electronics assembly, in conjunction with Lee Herrmann from Technology Plus, announces that it will highlight numerous products and technologies at the upcoming Wisconsin/Great Lakes Expo & Tech Forum, scheduled to take place Tuesday, November 10, 2009 at the Wyndham Airport Hotel in Milwaukee, WI.
Industry News | 2011-02-15 20:35:09.0
The featured systems in booth # 2247 will include the Pilot M4 Flying Prober and the Firefly Laser Selective Soldering system. We are proud to announce that Seica’s original Quick Test software has been selected for the Innovative Technology Center, as well as for a poster presentation, which will be held on April 14th from 3:30 – 4:30pm.
Industry News | 2012-02-22 01:47:58.0
Nihon Superior will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo.
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