JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050Board size:50×50-650×370mmFeeder inputs:max.112placement capacity:47,000 CPHProduct description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5050,Board size:50×50-6
New Equipment | Tape and Reel Services
Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most compani
Electronics Forum | Fri Dec 03 18:01:56 EST 1999 | M Cox
Usually the alignment problem comes from pad design. The ground pad (largest) is too small. If that is the case (and even if it isn't) try placing a dot of SMT adhesive before placement (it will cure before reflow and hold the part in place). Goo
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
TI New and Original THS4281DBVR in Stock SOT-23-5, 2122+ THS4281DBVR Ultra Low Power, High Speed, Rail-to-Rail I/O, Voltage Feedback Operational Amplifier Today's Hot Deals： TCD2220 QFP Dice 12+ L9301-TR HSSOP36 ST 21+ CD4093BE DIP-14 TI
TI New and Original TMS320VC5509APGE in Stock IC LQFP144, 2015+ package TMS320VC5509APGE The TMS320VC5509A fixed-point digital signal processor (DSP) is based on the TMS320C55x DSP generation CPU processor core. Today's Hot Deals： TCD2
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/wafer-inspection-and-metrology
. Find defects such as cold joints, head in pillow and misalignment in 2.5D and 3D wafer level packages. Quadra 7 is a versatile, lab based solution for wafer level inspection offering industry leading magnification and image quality
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
Identifying and Correcting Solder Bridge Defects | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
winsouce.jpg)
.gif)
