Industry News | 2008-04-28 14:27:00.0
Linear 2 Feature Allows Depth Control for HDI Blind Via Capabilities
Up to 20 layers, 4 mil traces / spaces, 6 mil drilled holes and Book-bind capability. MIL-P-50884 approved for adhesiveless materials. Deliveries down to 3 days are available.
Capabilities include: Up to 30 layers, 3 mil traces and spaces, 6 mil drilled holes, available in 24 hours to 2 weeks.
Capabilities include: 1 to 20 layers, adhesive based or adhesiveless, 3 mil traces and spaces, 6 mil drilled holes, available in 3 days to 20 days
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
With a 10.4'' transflective display, hot-swap batteries and IP65 sealing, the HH3 is top of the line for outdoor use, from sales force to drilling rigs.
The Laser Microjet� grinding system is suitable for grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge. For more information please visit our website
Industries : Conveyor Systems & Dry-Cleaning Electronics Military & Defense Railroad Construction Steel Fabricators Materials : 18-8 Stainless Steel 316 Stainless Steel Aluminum Steel Platings : Passiv
New Equipment | Fabrication Services
Minimum line width/space: 5mils Surface finish: OSP Board thickness: 1.60MM Minimum drilled hole diameter: 10mils Copper thickness: 0.5oz
Industry News | 2011-02-26 01:09:14.0
Pho-Tronics, Wisconsin, has recently announced that they purchased a Posalux Ultra Speed PCB drilling machine to expand capabilities and to further improve productivity. A second will follow later this year as part of their capital investment program and Technology Roadmap.
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