Full Site - : electrically conductive epoxy copper (Page 8 of 42)

Engineered Conductive Materials to Discuss New ECA Technology at the 8th CSPV Workshop in Shanghai

Industry News | 2012-11-27 15:42:35.0

Engineered Conductive Materials, LLC,, will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming China Solar Grade Silicon and PV Power Conference (CSPV), scheduled to take place December 6-8, 2012 at the Shanghai Nan Jiao Hotel in Shanghai, China.

Engineered Conductive Materials, LLC

Averatek Opens New Channels for Mina™ Surface Treatment

Industry News | 2022-03-14 08:18:45.0

Averatek is pleased to announce the addition of Jeff Berlin of TEC Associates to its marketing efforts. As a manufacturer's' representative, Berlin will be responsible for business development with Mina™, a surface treatment that enables soldering to aluminum. Replacing silver-based ACP (Anisotropic Conducting Paste) with solder, Mina™ offers more cost-effective and environmentally friendly manufacturing, with shorter processing times and reduced wet-chemistry steps.

Averatek Corporation

Engineered Material Systems Introduces Low-Cost Jettable Conductive Adhesive for Photovoltaic Stringing and Bussing Applications

Industry News | 2013-06-24 10:34:13.0

Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.

Engineered Materials Systems, Inc.

A New Low-Cost Conductive LED Die Attach Adhesive Is Now Available for Small Die and LEDs

Industry News | 2013-04-29 12:50:23.0

Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.

Engineered Materials Systems, Inc.

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2022-01-03 07:38:59.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2021-10-31 04:57:58.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation

Viscom AOI

Viscom AOI

Videos

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

Industry News | 2013-09-24 14:26:38.0

Engineered Material Systems debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications

Industry News | 2013-10-22 14:45:08.0

Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost, Snap Cure Conductive Adhesive for Die Attach Applications

Industry News | 2014-01-07 18:42:22.0

Engineered Material Systems debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.


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