Full Site - : enig vs emersion (Page 3 of 5)

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

Carbon Ink vs Immersion Gold for key pads.

Electronics Forum | Wed May 03 15:56:25 EDT 2006 | Board House

Hi Patrick, Thank you for the info, We like to push ENIG, for us being the ENIG line is in house it is cheaper to use than the carbon, plus shelf life of the Carbon is an issue in Storage. Pre-application. Thanks again, Mike

Carbon Ink vs Immersion Gold for key pads.

Electronics Forum | Wed May 03 22:14:29 EDT 2006 | davef

We think well done carbon ink and well done ENIG are equally reliable [maybe 1M operations]. If the gold is pourous [not all that an uncommon], ENIG is far less reliable than carbon ink.

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Wed Mar 23 12:45:24 EST 2005 | jdumont

Any reason why you would switch to Immersion Ag from ENIG? I am also considering the use of Immersion Ag (switching from good ol 63/37). Are there any papers on the benifits/problems of ENIG vs Immersion Ag?? Thanks in advance JD

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Wed Mar 16 14:12:19 EST 2005 | KT

We are moving from ENIG to Immersion Ag. We notice PCB's with Ag finish getting more heat(increase in peak temp) than the ENIG. Any reasoning behind this phenomenon ? KT

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Wed Mar 16 20:53:31 EST 2005 | KEN

Where does this notion that thermal profiling is absolute come from?

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Thu Mar 17 06:48:18 EST 2005 | Rob

The people who charge lots of money for their thermal profiling products.

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Thu Mar 17 06:59:07 EST 2005 | Grant

Hi, Thermal profiling is not absolute? It seems to work great for us. Regards, Grant

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Tue Mar 22 19:26:20 EST 2005 | Kt

Its not IR oven. Its consitent variation of around 3 - 5 degrees.

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:38:28 EST 2000 | Dave F

OK, now let me ask the really dopey question ... so if the irregularity of the HASL surface is punching holes in the thermal gasket and causing shorts to the heat sink, why are you putting solder on that surface? I wonder how the thermal conductivit


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