New Equipment | Assembly Services
PCB Assembly Quickturn and Prototype PCB Assembly. That's what you need, that's what we do. We can support small engineering projects up to full turn-key, medium volume production. With in-house process verification tools like AOI, Xray and Ersas
The NPI center's primary functions are rapid design validation, identifying DFM enhancements and cost reduction opportunities and facilitating a smooth transfer to production. The self-contained work-cells include staff dedicated solely to prototype
Industry News | 2018-05-21 20:56:43.0
Kurtz Ersa today announced that it held a successful sales meeting with hands on training for its North American sales representatives. The training was held May 16-17, 2018 at the company’s Plymouth facility and kicked off with a welcome speech from Albrecht Beck, President and CFO of Kurtz Ersa Inc.
Electronics Forum | Thu Jun 19 13:39:47 EDT 2003 | Steve
So how much clearance between components (in mm) does the Ersascope require? What if you have caps around (2-3mm from the BGA's edge) a BGA . . . is it necessary to remove them prior to inspection of the BGA?
Electronics Forum | Wed Jul 09 15:54:51 EDT 2003 | Louis
I need advice from someone who has already soldered this part or similar fine-pitch BGA with metal heatsink on top Should I solder it in the oven or it's better with a rework station (IR 550A Ersascope) Thanks All
Electronics Forum | Tue Oct 21 23:28:59 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Tue Oct 21 23:29:08 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Wed Jan 05 11:43:11 EST 2000 | Dave F
Yins, In low volume applications, using X-ray for BGA mounting process control is: 1 Very expensive approach, as you've stated. 2 Requires beaucoup operator training and interpretation of results. Which is double bad, because of the intermittent n
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
.gif)
.jpg)
