Industry News | 2022-11-07 19:55:14.0
IPC India has announced the 2nd annual Integrated Electronics Manufacturing & Interconnections (IEMI) event scheduled on August 1, 2023 in Chennai, and on August 3, 2023, in Pune, India. Pre-event activities will start this November with skill competitions in hand soldering/wire harness/PCB design and member networking events at various locations in India and other countries. IEMI 2023 will be focused on automotive (EV), defence and industrial automation vertical market sectors.
Industry News | 2010-09-02 11:07:09.0
The SMTA and Chip Scale Review magazine are pleased to announce Peter Ramm, Fraunhofer EMFT, as the Opening Speaker at the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2010-08-17 14:08:36.0
The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.
Industry News | 2010-10-20 21:21:00.0
The SMTA and Chip Scale Review magazine are pleased to announce the 7th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2011-11-08 15:31:27.0
The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Industry News | 2023-06-13 18:25:04.0
Electronics manufacturers to gather in Chennai August 1 and Pune, India, August 3
Industry News | 2024-03-26 13:55:04.0
Today's system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Industry News | 2010-03-22 15:12:19.0
BANNOCKBURN, Ill, USA, March 19, 2010 — In a positive sign that economic recovery is on the upswing, more than 120 new products and services from companies in the electronics manufacturing industry will debut at IPC APEX EXPO™, April 6–8, 2010, at the Mandalay Bay Resort and Convention Center in Las Vegas.
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