Full Site - : exposed copper on test pad (Page 4 of 6)

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty

| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon

| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 09:02:18 EST 1998 | Earl Moon

| | | Hi folks , | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our in

Re: Black spots on gold finish pads.

Electronics Forum | Fri Dec 04 20:26:34 EST 1998 | kallol Chakraborty

| | | | Hi folks , | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Ou

Re: Black spots on gold finish pads.

Electronics Forum | Fri Dec 04 20:37:45 EST 1998 | kallol chakraborty

| | | | | Hi folks , | | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F

Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in

Question on Pad Size for ICT Test Points

Electronics Forum | Tue Aug 07 21:17:24 EDT 2001 | davef

This provides LT 3 misses /1M hits. * Probe all points on one side of the board. Bonus => This lower fixture cost. * Test pads and vias: GT 25 thou from other land traces. * Small [LT 5 ohm] resistor measurements: Use two pads at each end and do 4-

solder question on crystal in DFN style package

Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist

We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X


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