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Other courses related to electronics manufacturing and assembly
ENERGY1 - TECHNICAL CONSULTANT FOR POWER , UTILITIES AND MANUFACTURING
Technical Library | 2018-12-05 14:52:23.0
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of material and process changes such as the shift from precious metal electrode (PME) configurations which were predominantly silver/palladium to base metal electrodes (BME) dominated by nickel. Each of these changes were accompanied by both quality and reliability problems. The MLCC industry is now in the midst of an unprecedented set of challenges similar to the Moore’s Law challenges being faced by the semiconductor industry. While capacitor failures have historically been responsible for a significant percentage of product field failures (most estimates are ~30%) we are seeing disturbing developments in the low voltage (
Industry Directory | Manufacturer
A worldwide supplier of electronic components specializing in quality potentiometer products.
Industry Directory | Manufacturer
Quality AC/DC and DC/DC Power Supply Solutions Where Performance and Reliability is Critical.
Industry Directory | Distributor
Cupio provides and supports equipment for some of the world's top suppliers of test and inspection equipment aimed at production inspection and repair test.
Technical Library | 2024-04-22 20:16:01.0
The solid-state electronics industry faces relentless pressure to improve performance, increase functionality, decrease costs, and reduce design and development time. As a result, device feature sizes are now in the nanometer scale range and design life cycles have decreased to fewer than five years. Until recently, semiconductor device lifetimes could be measured in decades, which was essentially infinite with respect to their required service lives. It was, therefore, not critical to quantify the device lifetimes exactly, or even to understand them completely. For avionics, medical, military, and even telecommunications applications, it was reasonable to assume that all devices would have constant and relatively low failure rates throughout the life of the system; this assumption was built into the design, as well as reliability and safety analysis processes.
Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
New Equipment | Board Handling - Pallets,Carriers,Fixtures
ICT fixture,abbreviation of In-circuit-test fixture,is a kind of inspection amd test fixture which performs inspection on the electrical performance and electrical connection of the components in process for any manufacturing defects and bad componen
Technical Library | 2019-04-11 06:04:49.0
With the development of science and technology, the climatic chamber quality has been improved, and the failure rate is reduced, but there still have the failure probability.today we introduce what are the mian factors for big noise high low temperature test chamber: 1.External factors: the bottom angle is uneven, the ground is uneven, adjust the bottom angle, ensure the equipment is in a horizontal position; 2.The equipment is touched other objects or pushed against the wall,pls remove the objects and keep a certain distance from the wall. 3.Compressor noise:check whether the compressor collides with the pipeline,and evaporator dish is loose or not. 4.Check whether compressor shock absorbers are aging and replace them. 5.Solenoid valve noise: solenoid valve reversing caue loud sound, pls add damping glue, if no effect, need to replace solenoid valve. If there is AC noise, need to replace the power board. 6.Check wether the fan or the fan string shaft make noise,whether the fan blades are touched and deformed, whether the fan is fixed or not, pls adjust accordingly or add the rubber pad. If further technical questions,contact us without hesitation!---Climtest Symor® technical team
Technical Library | 2020-12-10 15:49:40.0
Electronic assemblies should have longer and longer service life. Today there are partially demanded 20 years of functional capability for electronics for automotive application. On the other hand, smaller components, such as resistors of size 0201, are able to endure an increasing number of thermal cycles until fail of solder joints, so these are tested sometimes up to 4000 cycles. But testing until the end of life is essential for the determination of failure rates and the prognosis of reliability. Such tests require a lot of time, but this is often not available in developing of new modules. A further acceleration by higher cycle temperatures is usually not possible, because the materials are already operated at the upper limit of the load. However, the duration can be shortened by the use of liquids for passive tests, which allow faster temperature changes and shorter dwell times because of better heat transfer compared to air. The question is whether such tests lead to comparable results and what failure mechanisms are becoming effective. The same goes for active temperature cycles, in which the components itself are heated from inside and the substrate remains comparatively cold. This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
