New Equipment | Board Handling - Storage
Features: 1.The humidity value is controlled between 1% and 50% RH. 2.Environmental protection and energy saving, using physical molecular sieve dehumidification method, can be reused repeatedly, dehumidification effect is good, and low power consu
New Equipment | Tape and Reel Services
Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most compani
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Industry News | 2012-10-09 16:13:23.0
Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Technical Library | 2016-06-16 15:29:31.0
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.
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Automatic Glue Dispenser for Underground and Underwater Lights Inquiry：WhatsApp/wechat：+86 13535032180 PGB-700 AB Two Component compound Dispensing Machine Daheng Automation specializes in potting and dispensing systems for various resin applicat
ORION Industries | http://orionindustries.com/pdfs/kapton.pdf
the same temperature and humidity conditions before and after conditioning. To ensure sample/ambient equilibrium before and after conditioning, specimens should be exposed for 3 hr. 5 Width Tolerance The maximum variation in film width from that
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
factors that leads to water film formation on PCBA under humid conditions and show how these factors on the other hand can be used as a means to minimize humidity interaction with PCBA. Aim is to show the possibility of enhancing intrinsic humidity
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