The Model 1550 Stencil & Pallet Cleaner is our most popular semi-automatic system. It is designed to clean stencils up to 29" x 29" (740 x 740 mm) and fully equipped with the following integrated options: Heated Wash Tank Filter Recirculator
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
New Equipment | Assembly Services
Turnkey PCB assembly forms a core part of our manufacturing capability. We support all levels of production from low volume prototypes to the ongoing, sustained production requirements needed to get your products to market. Prototype Assembly We
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Industry News | 2009-09-17 15:08:48.0
GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2009-01-21 20:01:04.0
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, February 10-12, 2009.
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.
